Encapsulants face a unique combination of challenges once in-service. Thermal cycling can cause mechanical stress via high rates of expansion and contraction. In high temperature environments, an encapsulant’s mass can trap heat leading to premature thermal degradation. Our range of encapsulants deliver the ‘toughness’ to withstand thermal cycling, and where needed, the measure of thermal conductivity to allow for proper heat flow.

Beyond the effects of temperature, high voltage applications place a demand for high dielectric performance. Caustic and explosive environments can require strong chemical resistance, while process and dispensing constraints may necessitate a certain viscosity, from very thick materials that resist ‘sag’ to pourable options that flow easily, in order to fill voids around objects of varying shapes and orientations. We address all of these challenges and more when reviewing your material needs.

Let us help you with the challenges present in your application.

Frequently Requested / Addressed Material Properties
  • Thermal Class
  • Thermal Cycling
  • Dielectric Insulation
  • Thermal Conductivity
  • Compressive Strength
  • Impact Strength
  • Pot Life / Working Life / Set Time
  • Viscosity / Consistency (thick-to-thin)
  • Room Temperature Cure / Heat Cure
Questions We Ask About Encapsulants
  1.  How do you anticipate applying the material?
  2.  What are your adhesion requirements?  How is adhesion defined (i.e., test method)?
  3.  What are your bonding surfaces?
  4.  What is the approximate volume to encapsulate?  Are there mass and/or exothermic temperature considerations?
  5.  Would you like this to be a single-component (elevated temp cure) or two-component (room temp cure) system?
  6.  What are your physical property requirements?
    •  Viscosity / rheology (thick, pourable)
    •  Hardness
    •  Flexibility
    •  Mechanical strength requirements (flexural, compressive, tensile, or a combination)
    •  Chemical / environmental / flame resistance
    •  Thermal aging / thermal class
    •  Electrical properties, such as dielectric, semi-conductive or conductive
    •  Color
  7.  What are your application and curing conditions?
  8.  What are you pot life / working time requirements?
  9.  Can the product contain solvents, or must it be 100% solids?
General Questions We Ask
  1. What is your application?
  2. What material/product are you using now, and what properties/conditions/processes are you looking to improve?
  3. Are there any applicable specification requirements?  If so, please describe?
  4. Are there EHS restrictions or concerns?  If so, please describe?
  5. Do you have a specific type of packaging or material application process in mind?